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Failure Analysis

On-orbit failures can be devastating to a mission, potentially resulting in total losses in the hundreds of millions of dollars, or more.

Comtech TCS engineers have broad experience with high-reliability EEE component types and with an immense set of failure analysis methodologies and techniques. We utilize a vast network of laboratory capabilities, inside and outside of our facilities, to guide the customer to a root cause and corrective action.

  • Electrical testing (bench and automated)
  • Hermeticity testing: fine leak, gross leak, open-face
  • Die shear and probing
  • SEM inspection and energy-dispersive spectroscopy
  • DLA-certified RGA testing
  • Radiography (real-time or wet-film x-ray, and n-ray)
  • Voltage contrast imaging
  • Electron beam induced current (EBIC) analysis
  • C-mode scanning acoustic microscopy (C-SAM)
  • Fourier-transform infrared (FTIR) spectrometry and other organic analysis
  • Infrared thermal imaging and digital imaging
  • Bond strength (destructive and nondestructive)
  • PIND testing and bit mapping
  • Cross sectioning, metallurgical and junction etching
  • Metallurgical analysis
  • High and low magnification optical photo documentation
  • Photoemission miocroscopy
  • Computed tomography (3D imaging)
  • Auger electron spectroscopy and other surface analysis
  • Fractography and fracture mechanics

Contact Comtech TCS Space & Component Technology

1 866.264.0793

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